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Sampling techniques for the analysis of microscopic foreign substances.

We will report rapid analysis results using various sampling techniques regarding foreign substances that have a significant impact on the yield of electronics products.

■Special Sampling Techniques for Foreign Substances in Multilayer Films - Foreign substances buried in metal films on substrates Metal film etching ⇒ Transfer to Si wafer ⇒ FT-IR analysis - Foreign substances in multilayer thin films Cutting off the surface layer ⇒ Transfer to Si wafer ⇒ FT-IR analysis Microtome/FIB thinning ⇒ Transfer to Si wafer ⇒ FT-IR analysis

  • Other analytical equipment

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